Blind/buried Via Board

Blind/buried Via Board
Product Details

Product name:blindburied via board 


Layer count: 8
Board thickness: 1.2mm
Base materials: FR4 S1000-2
Finished size:205*174mm
Surface finish:ENIG+OSP
Line width/line space: 3/3mil
Minimum hole: 0.10mm
Solder resist color: Sensitive blue
Cu thickness: inner layer 1OZ outer layer 1OZ


1.complicated structure of blind/buried hole, two stage HDI:
blind hole: L1-L2,L5-L6
buried hole: L2-L3,L3-L4,L4-L5
through-hole: L1-L8

repeatly lamination , chem copper

need laser to drill blind hole

line width/line space is small, etching is difficult

lamination,circuit,drilling with High accuracy standard

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